LT3491
PACKAGE DESCRIPTIO
SC8 Package
8-Lead Plastic SC70
(Reference LTC DWG # 05-08-1639 Rev ?)
0.30
MAX
0.50
REF
PIN 8
1.80 – 2.20
(NOTE 4)
1.00 REF
INDEX AREA
2.8 BSC 1.8 REF
1.80 – 2.40 1.15 – 1.35
(NOTE 4)
PIN 1
(NOTE 6)
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.50 BSC
0.15 – 0.27
8 PLCS (NOTE 3)
0.10 – 0.40
0.80 – 1.00
0.00 – 0.10
REF
1.00 MAX
GAUGE PLANE
0.15 BSC
0.26 – 0.46
0.10 – 0.18
SC8 SC70 0905 REV ?
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 AND JEDEC MO-203 VARIATION BA
DC Package
6-Lead DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
R = 0.115
TYP
0.38 ± 0.05
0.675 ± 0.05
0.56 ± 0.05
(2 SIDES)
4
6
3
1
2.50 ± 0.05
1.15 ± 0.05 0.61 ± 0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
1.42 ± 0.05
(2 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
0.25 ± 0.05
0.50 BSC
1.37 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3491fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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